Finite element model updating based on response surface methodology

The FE model is updated through three consecutive stages.

In each stage, the first three resonant frequencies are calculated using ANSYS and correlated with modal test results.

The random vibration test response of the PCB is compared with simulation results.

Early FE model updating methods include direct methods [].The complexity of these models depends on if the internal stresses of components are required. related the fatigue parameters obtained with harmonic excitation to the fatigue life of ball grid array (BGA) solder joints under the random excitation [].Effective strains were calculated and combined with the three-band techniques to predict solder joint survivability.The Von Mises stress power spectral density (PSD) of the critical solder joint is calculated and transferred into time-history data.The rainflow cycle counting (RFCC), the S–N curve and the Miner’s rule are combined to estimate the cumulative damage of the critical solder joints.

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